Horizontal vapor deposition device
Double-sided film formation, edge film formation, compact, large batch processing. The substrate's self-rotation mechanism enables control of the deposition surface. Providing unique processes for quartz oscillators and thin-film resistors.
Equipped with a unique substrate mechanism ideal for double-sided film deposition on small substrates and small-diameter wafers, edge film deposition on ceramic substrates, and mask film deposition. A standard horizontal deposition device with a large processing capacity in a compact chamber. Various options for evaporation sources, heating temperatures, and exhaust systems are available. Capable of handling a wide range of applications from resin decoration to mass production of electrode formation for electronic components with a proven unique mechanism.
- Company：神港精機 東京支店
- Price：Other
